Rather than grouping exhibits by product category, the show centers on specific industrial demands, including automotive-grade reliability and Embodied AI. This architecture connects the entire value chain, from initial chip design and wafer fabrication to advanced packaging and downstream system integration. Organizers have structured the floor into five dedicated zones to emphasize commercialization and synergy between tech providers and end-users.

Technical programming runs parallel to the exhibition floor, featuring a flagship summit and over ten specialized forums. These sessions target key industry shifts, such as the evolution of high-performance memory, next-generation packaging, and the integration of robotics. As part of a 300,000-square-meter trade event, the show facilitates precision business matchmaking for global technology providers and industrial buyers. Pre-registration is currently open for professionals looking to engage with the latest developments in chip-intelligence convergence.