The company’s strategic shift hinges on the surging demand for high-value-added semiconductor substrates, driven by 5G rollout, AI integration, and the recovery of the memory market. In 2025, the package solution segment generated approximately $1.11 billion in sales, marking an 18% year-over-year increase, with operating profits jumping 82% to $83 million. This division now accounts for nearly 20% of the firm's total operating profit, despite representing only 10% of total sales.

Technological leadership in RF-SiP substrates, where LG Innotek holds roughly 65% of the global market, provides the foundation for this growth. By pioneering Cu-Post manufacturing—a process that allows for tighter solder ball spacing and thinner device architecture—the firm has successfully addressed the industry's need for thinner 5G handsets. This innovation is now being applied to the burgeoning AI sector, with recent orders for GDDR7 memory substrates already pushing production lines at the Gumi plant to maximum capacity. Further expansion is planned for a new facility in Vietnam.

To capture the high-end PC and AI server market, LG Innotek has invested in its "Dream Factory," a smart facility dedicated to large-body FC-BGA substrates. These substrates, which are significantly more complex than mobile counterparts, are essential for the next generation of CPUs and GPUs. With the global FC-BGA market expected to reach $9.548 billion by 2032, the company is actively securing partnerships with global big tech firms to solidify its position as a primary supplier for autonomous vehicle and data center components.