The Suzhou production base began pilot operations in October 2025. Through refined System-in-Package (SiP) integration, Longsys has transitioned from traditional PCB-based storage to a more compact architecture that bundles the controller, NAND flash, and power management into a single unit. This design shift simplifies the manufacturing cycle while increasing reliability for AI-focused hardware.

Longsys currently deploys both PCIe Gen4 and Gen5 solutions, the latter utilizing integrated vapor chamber cooling to manage the thermal demands of intensive AI workloads. By consolidating these components, the company aims to support the hardware requirements for AI PCs and intelligent terminals. Beyond hardware, the firm recently introduced its proprietary SPU and iSA technologies to create an integrated software-hardware environment for storage management. With production now stabilized at scale, Longsys is targeting further integration of these storage modules into automotive and industrial-grade applications, while preparing to support future PCIe Gen6 specifications.