The semiconductor solutions provider saw its mainstream business flourish as thermal management needs spiked, directly tied to the power density requirements of modern AI systems. This performance signals a robust shift in the manufacturing landscape, prompting the board to issue an interim dividend of 0.97 Hong Kong dollars—a significant climb from the 0.26 figure recorded in the previous year.

Looking ahead, the company projects third-quarter revenue to land between 630 million and 690 million U.S. dollars, a potential 46% gain on an annual basis. Despite a 14% retreat in share price on Tuesday amid wider market jitters regarding AI investment sustainability, the stock maintains an 81% gain year-to-date. Management remains confident that the ongoing proliferation of AI applications will continue to underpin structural demand for its specialized assembly and packaging equipment.